BS EN 61190-1-3-2007 电子组装件用附件材料.电子钎焊用电子级钎焊合金和有助熔剂和无助熔剂的固体焊锡的要求

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【英文标准名称】:Attachmentmaterialsforelectronicassembly-Requirementsforelectronicgradesolderalloysandfluxedandnon-fluxedsolidsoldersforelectronicsolderingapplications
【原文标准名称】:电子组装件用附件材料.电子钎焊用电子级钎焊合金和有助熔剂和无助熔剂的固体焊锡的要求
【标准号】:BSEN61190-1-3-2007
【标准状态】:现行
【国别】:英国
【发布日期】:2007-07-31
【实施或试行日期】:2007-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:合金;应用;组件;化学成分;分类;组分;定义;名称与符号;电子工程;架设(施工作业);助熔剂(材料);检验;金属含量;无铅;合格;质量;质量保证;分规范;焊接合金;钎焊;焊锡;规范(验收);测试
【英文主题词】:Alloys;Applications;Assemblies;Chemicalcomposition;Classification;Composition;Definition;Definitions;Designations;Electronicengineering;Erecting(constructionoperation);Fluxes(materials);Inspection;Metalcontent;Non-leaded;Qualifications;Quality;Qualityassurance;Sectionalspecification;Solderalloys;Solderings;Solders;Specification(approval);Testing
【摘要】:ThispartofIEC61190prescribestherequirementsandtestmethodsforelectronicgradesolderalloys,forfluxedandnon-fluxedbar,ribbon,powdersoldersandsolderpaste,forelectronicsolderingapplicationsandfor“special”electronicgradesolders.Forthegenericspecificationsofsolderalloysandfluxes,seeISO9453,ISO9454-1andISO9454-2.Thisstandardisaqualitycontroldocumentandisnotintendedtorelatedirectlytothematerial'sperformanceinthemanufacturingprocessSpecialelectronicgradesoldersincludeallsolderswhichdonotfullycomplywiththerequirementsofstandardsolderalloysandsoldermaterialslistedherein.Examplesofspecialsoldersincludeanodes,ingots,preforms,barswithhookandeyeends,multiple-alloysolderpowders,etc.
【中国标准分类号】:L10;J33
【国际标准分类号】:25_160_50;31_190
【页数】:38P.;A4
【正文语种】:英语